倍加福

TCU1200-* (Intel® Atom Elkhart Lake Processor, Windows 10)

TCU1200-* (Intel® Atom Elkhart Lake Processor, Windows 10) Thin Client Unit (TCU)Generation 2024

订货号
T215610
产品分类
外围设备

Thin Client Unit

TECHNICAL DATA

规格参数

Hardware
ProcessorIntel® Atom Elkhart Lake x6211E
RAM4 GB
Mass storage64 GByte industrial grade MLC SSD
Input voltage24 V DC ± 10 % (SELV/PELV)
Power consumption14 W average, 30 W max.
Interface typeStandard:1 x Ethernet 100/1000BASE-TX (Ex e) or1 x fiber optic 1000BASE-SX (Multimode) or1 x fiber optic 1000BASE-LX (Singlemode),1 x USB 2.0 (Ex e; service port),2 x USB 1.1 (Ex i; intended for Pepperl+Fuchs keyboard and mouse) Optional:1 x barcode reader interface Pepperl+Fuchs Pscan-D/B (Ex i) "S3": 1 x barcode reader interface for wired 1-D scanners IDM-160-D*, IDM-Z1-160-D-* and base station IDMx61-B-* and IDM-Z1-x61-B-* (Ex i)"S4": 1 x barcode reader interface for wired 2-D Scanner IDM-Z1-260-D-* (Ex i)"S5": 1 x RS-232 interface with Power Supply for miscellaneous devices and peripherals (Ex i) 1 x RS-232 (Ex e) 1 x RS-485 (Ex e) 1 x Ethernet 100/1000Base-TX (Ex e) Bluetooth v4.0, communication distance up to 30 m in open terrain, transmission power +8 dBm, transmission frequency 2.402 ... 2.48 GHz
Electromagnetic compatibilityElectromagnetic compatibility
Directive 2014/30/EUEN 61326-1:2013 (industrial locations) ; EN 61000-6-4:2007+A1:2011Directive 2014/30/EUEN 61326-1:2013 (industrial locations) ; EN 61000-6-4:2007+A1:2011
RoHSRoHS
Directive 2011/65/EU (RoHS)EN 50581:2012-09Directive 2011/65/EU (RoHS)EN 50581:2012-09
Directive 2014/30/EUEN 61326-1:2013 (industrial locations) ; EN 61000-6-4:2007+A1:2011
Directive 2011/65/EU (RoHS)EN 50581:2012-09
Operating systemVisuNet RM Shell 6 (based on Windows® 10 IoT Enterprise LTSC 2021 x64) Optional:TSJ-: IGEL OS 12 (based on Linux, pre-installed without licence)TSI-: IGEL OS 11 (based on Linux, pre-installed without licence) (pending)
Operating temperature-20 ... 65 °C (-4 ... 149 °F)
Storage temperature-20 ... 65 °C (-4 ... 149 °F)
Relative humidity93% at 40°C, non-condensating, according to EN 60068-2-78
Shock resistance18 shocks 15 g , 11 ms all axis, IEC 60068-2-27
Vibration resistance10 ... 150 Hz, +/- 0.075 mm , 1g, 10 cycles per axis according to EN60068-2-6
Degree of protectionIP66 ( when mounted on the display unit from Pepperl+Fuchs )
MaterialMaterial
Housinganodized aluminumHousinganodized aluminum
Massapprox. 4 kg
Dimensions280 mm x 240 mm x 43 mm
Housinganodized aluminum
EU-type examination certificateBVS 16 ATEX E 082 X
Marking II 3G Ex ec [ib] IIC T4 IP66 Gc [exsign] II 3D Ex tc [ib] IIIC T85°C IP66 DcMarking II 3G Ex ec [ib] IIC T4 IP66 Gc [exsign] II 3D Ex tc [ib] IIIC T85°C IP66 Dc
Directive conformityDirective conformity
Directive 2014/34/EUEN 60079-0:2012+A11:2013, EN 60079-7:2015, EN 60079-11:2012, EN 60079-31:2014Directive 2014/34/EUEN 60079-0:2012+A11:2013, EN 60079-7:2015, EN 60079-11:2012, EN 60079-31:2014
MarkingII 3G Ex ec [ib] IIC T4 IP66 Gc [exsign] II 3D Ex tc [ib] IIIC T85°C IP66 Dc
Directive 2014/34/EUEN 60079-0:2012+A11:2013, EN 60079-7:2015, EN 60079-11:2012, EN 60079-31:2014
IECEx approvalIECEx BVS 16.0060X
Approved forEx ec [ib] IIC T4 IP66 GcEx tc [ib] IIIC T85°C IP66 DcStandardsIEC 60079-0:2011, IEC 60079-7:2015, IEC 60079-11:2011, IEC 60079-31:2013Approved forEx ec [ib] IIC T4 IP66 GcEx tc [ib] IIIC T85°C IP66 DcStandardsIEC 60079-0:2011, IEC 60079-7:2015, IEC 60079-11:2011, IEC 60079-31:2013
Approved forEx ec [ib] IIC T4 IP66 GcEx tc [ib] IIIC T85°C IP66 Dc
StandardsIEC 60079-0:2011, IEC 60079-7:2015, IEC 60079-11:2011, IEC 60079-31:2013

DOCUMENTS & DOWNLOADS

资料与附件

产品数据表 Datasheet
语言:en
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品牌:倍加福 型号:TCU1200-* (Intel® Atom Elkhart Lake Processor, Windows 10)